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About Brand
Winbond Electronics (WINBOND) was founded in September 1987, listed on the Taiwan stock exchange in 1995. Today's Winbond company specializes in integrated circuit memory for positioning, the main business include product design, technology research and development, manufacturing, marketing and customer service service wafer, committed to advanced semiconductor design and manufacturing technologies, to provide customers with special specifications of memory solution. Winbond product business group "DRAM" and "IC group" and "flash memory IC manufacturing group in the three major business groups as the core, the constant pursuit of innovation of products and technologies, to implement competitive advantage. DRAM products, with high speed and low power design technology at the core of memory, including Specialty, Mobile and DRAM launched Pseudo SRAM and Low Power SDRAM of the RAM series of products, can be widely used in consumer, communications, computer peripherals, automotive electronics and other four areas, and double data rate Graphics DRAM-GDDR the product is locked, personal computers, games and multimedia applications such as market demand for high efficiency and high speed graphics memory solutions.
Product Series：
Mobile Ram, Serial NOR Flash, 1.2V Serial NOR Flash, QspiNAND Flash, High Perance QspiNAND Flash, OctalNAND Flash
Application Areas：
Consumer electronics communications / network transportation / automotive industry / Automation
Related Brands：
WAGO WINSUN Weida Hi-tech Winsen WECO WIZnet WUXI HUAJING MICRO Wolfson Microelectronics plc WIMA Wi2Wi
Winbond

Winbond
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Company Address： Wu Han Office : Room1608 1st building Vanke Jincheng Phase III No.1008 XiongChu Avenue East Lake new technology development zone Wuhan HuBei Tel No.: 027-87806668


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Shenzhen Tianji Xingye Co., Ltd.  Guangdong ICP No. 202300469