According to the news on the morning of April 30, bluetooth chip manufacturer China blue blue and flat-top brother semiconductor reached a cooperation, the two sides will be based on flat-top brothers black iron series p...

Highly integrated power management、Charging、AC/DC the power conversion、Wi-FiAnd Bluetooth low energy technology vendorsDialogSemiconductor company(German stock exchange trading code：DLG)Announced today，It is the smallest...

The Bluetooth Technology Alliance (Bluetooth SIG) officially launched a new generation of Bluetooth 5 (Bluetooth 5) at the end of 2016. The transmission distance and transmission amount have been greatly improved compared with the Bluetooth 4.2 standard, but up to now, the popularity rate of Bluetooth 5 is still low. In this regard, Nordic points out that the import of mobile phone is the key to popularize Bluetooth 5, but because the application demand of Bluetooth 5 is not emerging, so the popularity rate is not as good as imaginable.

Smart speakers market is booming, including Google, apple (Apple), Amazon (Amazon) or Alibaba. However, in order to make the intelligent sound box in all corners of the home real-time voice operation, the industry is developing a wave to create the peripheral device of the voice control of the output / input of the intelligent sound box. It combines Bluetooth low power, microphone sensor and horn technology to assist the voice cancellation in real time to the remote intelligent sound box. The user experience of an intelligent sound box.

The solution includes a support for 20 links, multi-role, Bluetooth 5 certified S132 v5.0 protocol stack, in all role combinations to provide full-link concurrent.

Silicon Labs (also known as "Core Technology") has introduced a new multi-band SoC that supports full Bluetooth 5 connectivity and more storage capacity options to further expand its Wireless Gecko system single-chip (SoC) product line.

Toshiba Semiconductor and Storage Products announced two new "TC3567CFSG" and "TC3567DFSG" leading industry [1] to achieve lower current consumption than the plateau [2] and enhance the safety communication function. These two ICs are Toshiba's latest members of Bluetooth-enabled low power (LE) [3] ver.4.2 communication chips. The sample is available.